1. the TDP limits are extended or disabled in the motherboards' BIOS.
2. the motherboard applies automatic overclocking by default, e.g. by raising the supply voltage of the CPU and using higher Turbo-Mode multipliers.
3. some software creates untypical loads, e.g. Prime95 with AVX2 support and a) and/or b) apply.

This can lead to temperature issues, especially when using smaller coolers or compact cases.

The actual power draw of the processor can be monitored with software provided by the motherboard vendor or with 3rd party tools like HWInfo or HWMonitor.

If you encounter temperature issues (>90°C) and notice a higher than specified power draw, please ensure that no automatic overclocking is applied and limit the TDP to the specified value by choosing appropriate BIOS settings.

For Kaby Lake CPUs, it may also help to lower the CPU clock speed for applications that heavily use the AVX instruction set, which can lead to higher loads and power draw. This option is usually referred to as “AVX offset” and makes it possible to lower the multiplier specifically for AVX based applications without reducing performance when using other instruction sets. Depending on the quality of the CPU and the programs being used, a reduction of 2-3 steps usually gives very good results.

Please contact your motherboard vendor for details if you have trouble finding the appropriate settings in the BIOS.

All our TDP recommendations are based on thorough testing with the default values specified by Intel using popular applications such as Asus Realbench and prime95. Please note, however, that prime95 creates a particularly high load that goes beyond typical application scenarios and this leads to elevated temperatures. We thus recommend using other programs such as Realbench for checking the stability and temperatures of the CPU in realistic scenarios.

Due to the heatsink mounting mechanism being identical on LGA2011 and LGA2066, Noctua’s SecuFirm2™ mounting systems for LGA2011 also support Intel’s upcoming ‘Basin Falls’ X299 HEDT (High End Desktop) platform for ‘Skylake-X’ and ‘Kaby Lake-X’ processors. Most current Noctua coolers already include SecuFirm2™ mounting systems for LGA2011 and can thus be used on LGA2066 motherboards without any upgrades or modifications.

The following models include a mounting-kit for socket LGA2011/2066 and are thus compatible out of the box:

NH-C14S
NH-D14 SE2011
NH-D15
NH-D15S
NH-D9L
NH-L12
NH-L9x65
NH-U12S
NH-U12DX i4
NH-U14S
NH-U9DX i4
NH-U9S

The following models can be made compatible with the LGA2011/LGA2066 sockets free of charge using the NM-I2011 upgrade-kit:

NH-C12P
NH-C12P SE14
NH-C14
NH-D14
NH-D15 SE-AM4
NH-U12S SE-AM4
NH-L9x65 SE-AM4
NH-U12
NH-U12F
NH-U12P
NH-U12P SE1366
NH-U12P SE2
NH-U9
NH-U9B
NH-U9B SE2
NH-U9F

The following models can be made compatible with the LGA2011/LGA2066 sockets using the NM-I2011 upgrade-kit but are not eligible for Noctua‘s free mounting offer, so users have to purchase the kit at local resellers:

NH-U12DO (Note that the A3 version is not compatible!)
NH-U12DX
NH-U12DX 1366
NH-U9DX 1366
NH-U9DO (Note that the A3 version is not compatible!)

The following models are not compatible with the LGA2011/LGA2066 sockets and can not be upgraded:

NH-L9a
NH-L9i
NH-U12DO A3
NH-U9DO A3

NH-D15 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D15 SE-AM4
NH-D15S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12S SE-AM4
NH-U9S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D9L (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-C14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-L12S
NH-L9x65 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-L9x65 SE-AM4
NH-L9a-AM4

The following models can be made compatible with the AM4 socket free of charge using the NM-AM4 upgrade-kit:

NH-C12P
NH-C12P SE14
NH-C14
NH-C14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D14
NH-D14 SE2011
NH-D15 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D15S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D9L (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-L12
NH-L9x65 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12
NH-U12F
NH-U12P
NH-U12P SE1366
NH-U12P SE2
NH-U9
NH-U9B
NH-U9B SE2
NH-U9F

The following models can be made compatible with the AM4 socket free of charge using the NM-AM4-UxS upgrade-kit:

NH-U14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U9S (AM4 mounting included since 2019, only older coolers require upgrade kit)

The following models can be made compatible with the AM4 socket free of charge using the NM-AM4-L9aL9i upgrade-kit:

NH-L9a
NH-L9i

The following models can be made compatible with the AM4 socket using the NM-AM4 upgrade-kit but are not eligible for Noctua‘s free mounting offer, so users have to purchase the kit at local resellers:

NH-U12DO (Note that the A3 version is not compatible!)
NH-U12DX
NH-U12DX 1366
NH-U12DX i4
NH-U9DX i4
NH-U9DX 1366
NH-U9DO (Note that the A3 version is not compatible!)

The following models are not compatible with the AM4 socket and can not be upgraded:

NH-U14S TR4-SP3
NH-U12S TR4-SP3
NH-U9 TR4-SP3
NH-U12DO A3
NH-U9 DO A3

Systems from Acer, Apple, Dell, HP, Lenovo or other major brands often use motherboards which differ slightly from the specifications issued by Intel and AMD. While those changes are usually subtle, they can lead to compatibility issues with coolers that were built to comply with these specifications.

Even in case the cooler is mechanically compatible and can be installed, other issues can occur, e.g. proprietary fan connectors, BIOS errors due to a low fan speed, shutdowns, etc. Some of these problems can be avoided with some technical knowledge, but especially BIOS related issues can often not be resolved.

Due to the large number of possible issues that cannot be resolved with different mounting parts alone, Noctua does not officially support systems from Acer, Apple, Dell, HP, Lenovo or other major brands.

Most motherboard vendors allow their overclocking-enabled products (e.g. those with Intels X- or Z-series chipsets) to run the processor at increased clock speeds by default, without requiring any user action at all. Since TDP (Thermal Design Power) limits are usually also disabled by default, this leads to the CPU exceeding the rated TDP to a varying degree, depending on the used applications and their workloads. Due to the increased heat output of the CPU, you may see higher CPU temperatures than expected.

In order to find out if your motherboard is overclocking your processor by default, please enter the UEFI BIOS and select the “advanced” or “overclocking” menu. There you should be able to find options such as “MultiCore Enhancement” (options: enabled/disabled), “CPU Ratio Apply Mode” (options: all/per core) or similar. To disable the automatic overclocking, adjust the settings either to “disabled” or “per core” and make sure that the individual multipliers match the original specifications.

In doubt, please contact your motherboard vendor for detailed instructions on how to disable this feature.

Current processors from Intel, especially the unlocked models with the suffixes C, K, X or XE (e.g. Core i7-8700K, Core i9-7900X oder Core i9-9900K) can dissipate noticeably more heat than indicated by the TDP specification.

While many motherboard models stick to the recommended power levels and clock speeds settings from Intel, there are models where the UEFI BIOS is configured in such a way that:

1. the TDP limits are extended or disabled.
2. the motherboard applies automatic overclocking by default, e.g. by raising the supply voltage of the CPU and using higher Turbo-Mode multipliers.

Depending on the load scenario and CPU configuration settings, the actual power draw can be 1.5-3 times as high the stated TDP value. This can lead to temperature issues, especially when using smaller coolers, compact cases or cases with poor airflow, when some applications create very high loads, e.g. Prime95 with AVX2 support, 3D-rendering or simulation software.

The actual power draw of the processor can be monitored with software provided by the motherboard vendor or with 3rd party tools like HWInfo or HWMonitor.

If you encounter temperature issues (>90°C) and notice a higher than specified power draw, please ensure that no automatic overclocking is applied. You might also want to limit the TDP to either the specified value by Intel or a value that is 5-10W below the value previously read out from the CPU. This can be done in BIOS by setting the “Long Term Duration Power” manually instead of “Auto”.

Furthermore, it may also help to lower the CPU clock speed for applications that heavily use the AVX instruction set, which can lead to higher loads and power draw. This option is usually referred to as “AVX offset” and makes it possible to lower the multiplier specifically for AVX based applications without reducing performance when using other instruction sets. Depending on the quality of the CPU and the programs being used, a reduction of 2-3 steps usually gives very good results.

The option to set an AVX-offset value is usually available for the following CPU generations:

• LGA1151:7th, 8th and 9th generation (Kaby Lake, Coffee Lake)
• LGA2011-3: 6th generation (Broadwell-E)
• LGA2066: 7th and 8th generation (Skylake-X)

Please contact your motherboard vendor for details if you have trouble finding the appropriate settings in the BIOS.

All our TDP recommendations are based on thorough testing with the default values specified by Intel using popular applications such as Asus Realbench and prime95. Please note, however, that prime95 creates a particularly high load that goes beyond most typical application scenarios and this leads to elevated temperatures. We thus recommend using other programs such as Realbench for checking the stability and temperatures of the CPU in realistic scenarios.

Please also note that CPUs that use thermal paste instead of soldering between the DIE and the heatspreader generally run hotter. Due to the thermal bottleneck created by the thermal paste, temperatures can be high even at the specified TDP.

The latest Ryzen 3000 processors (except APU models) differ from previous Ryzen generations in that they are no longer based on a single, large chip but use a multi-chip approach with smaller chips instead. Depending on the exact model there can be one (6 and 8-core models) or two (12 and 16-core models) actual CPU-Dies (CCD) on the package. Each processor also uses an I/O-Die (IOD), which contains things like the memory controller, PCIe controller, connections to the motherboard chipset and other functions.

Because of this design change and the switch to a smaller 7nm manufacturing process, the heat distribution of the overall processor is much different from older 14nm and 12nm based single-chip Ryzen processors with a similar power draw.

Depending on the exact CPU model, its specified TDP value and possibly extended power limits (precision boost overdrive), a single CPU-die can create a heatload of up to 130W easily, whereas the I/O-die usually creates a heatload of about 10W. Due to the small size of the CPU-die, the heat density (W/mm²) of this chip is very high. For example, a 120W heatload at a chip-size of 74mm² results in a heat-density of 1.62W/mm², whereas the same heatload on an older Ryzen processor with a chip-size of 212mm² gives a heat-density of just 0.57W/mm².

This large difference in heat-density is the reason why newer Ryzen 3000 processors become much warmer at similar heatloads than their predecessors.

Furthermore, Ryzen 3000 CPUs are using the rated temperature headroom (up to 95°C) quite aggressively in order to reach higher boost clocks. As a result, it is absolutely no problem and not alarming if the processor runs into this temperature limit. The clock speed and supply voltage will be adjusted automatically by the processor itself in order to remain within AMD’s specifications and to prevent overheating.

Due to the higher heat density, higher thermal limits and more aggressive boost clock usage, it is perfectly normal that Ryzen 3000 CPUs are reaching higher temperatures than previous generation Ryzen CPUs with the same TDP rating. Higher CPU temperatures are normal for Ryzen 3000 processors and not a sign of that there is anything wrong with the CPU cooler.

If you're using two fans, please install them so that one blows onto the heat-sink and the other sucks the air away from the other side.

Then hook the endings of the clips into the mounting holes of the fan:

In order to install the cooler on Asus X-socket™ mainboards, please first remove the mainboard’s LGA2011 backplate and install the LGA1366 backplate supplied with the mainboard instead (see the mainboard manual for detailed instructions). Then install the Noctua cooler as described in the supplied installation manual for LGA1366. In case you’ve lost the printed installation manual, you can download it here.