The latest Ryzen 3000 processors (except APU models) differ from previous Ryzen generations in that they are no longer based on a single, large chip but use a multi-chip approach with smaller chips instead. Depending on the exact model there can be one (6 and 8-core models) or two (12 and 16-core models) actual CPU-Dies (CCD) on the package. Each processor also uses an I/O-Die (IOD), which contains things like the memory controller, PCIe controller, connections to the motherboard chipset and other functions.

Because of this design change and the switch to a smaller 7nm manufacturing process, the heat distribution of the overall processor is much different from older 14nm and 12nm based single-chip Ryzen processors with a similar power draw.

Depending on the exact CPU model, its specified TDP value and possibly extended power limits (precision boost overdrive), a single CPU-die can create a heatload of up to 130W easily, whereas the I/O-die usually creates a heatload of about 10W. Due to the small size of the CPU-die, the heat density (W/mm²) of this chip is very high. For example, a 120W heatload at a chip-size of 74mm² results in a heat-density of 1.62W/mm², whereas the same heatload on an older Ryzen processor with a chip-size of 212mm² gives a heat-density of just 0.57W/mm².

This large difference in heat-density is the reason why newer Ryzen 3000 processors become much warmer at similar heatloads than their predecessors.

Furthermore, Ryzen 3000 CPUs are using the rated temperature headroom (up to 95°C) quite aggressively in order to reach higher boost clocks. As a result, it is absolutely no problem and not alarming if the processor runs into this temperature limit. The clock speed and supply voltage will be adjusted automatically by the processor itself in order to remain within AMD’s specifications and to prevent overheating.

Due to the higher heat density, higher thermal limits and more aggressive boost clock usage, it is perfectly normal that Ryzen 3000 CPUs are reaching higher temperatures than previous generation Ryzen CPUs with the same TDP rating. Higher CPU temperatures are normal for Ryzen 3000 processors and not a sign of that there is anything wrong with the CPU cooler.

Most motherboard vendors allow their overclocking-enabled products (e.g. those with Intels X- or Z-series chipsets) to run the processor at increased clock speeds by default, without requiring any user action at all. Since TDP (Thermal Design Power) limits are usually also disabled by default, this leads to the CPU exceeding the rated TDP to a varying degree, depending on the used applications and their workloads. Due to the increased heat output of the CPU, you may see higher CPU temperatures than expected.

In order to find out if your motherboard is overclocking your processor by default, please enter the UEFI BIOS and select the “advanced” or “overclocking” menu. There you should be able to find options such as “MultiCore Enhancement” (options: enabled/disabled), “CPU Ratio Apply Mode” (options: all/per core) or similar. To disable the automatic overclocking, adjust the settings either to “disabled” or “per core” and make sure that the individual multipliers match the original specifications.

In doubt, please contact your motherboard vendor for detailed instructions on how to disable this feature.

Systems from Acer, Apple, Dell, HP, Lenovo or other major brands often use motherboards which differ slightly from the specifications issued by Intel and AMD. While those changes are usually subtle, they can lead to compatibility issues with coolers that were built to comply with these specifications.

Even in case the cooler is mechanically compatible and can be installed, other issues can occur, e.g. proprietary fan connectors, BIOS errors due to a low fan speed, shutdowns, etc. Some of these problems can be avoided with some technical knowledge, but especially BIOS related issues can often not be resolved.

Due to the large number of possible issues that cannot be resolved with different mounting parts alone, Noctua does not officially support systems from Acer, Apple, Dell, HP, Lenovo or other major brands.

NH-D15 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D15 SE-AM4
NH-D15S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D15 chromax.black
NH-U14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12A
NH-U12S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12S SE-AM4
NH-U12S chromax.black
NH-U9S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D9L (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-C14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-L12S
NH-L9x65 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-L9x65 SE-AM4
NH-L9a-AM4

The following models can be made compatible with the AM4 socket free of charge using the NM-AM4 upgrade-kit:

NH-C12P
NH-C12P SE14
NH-C14
NH-C14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D14
NH-D14 SE2011
NH-D15 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D15S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-D9L (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-L12
NH-L9x65 (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12
NH-U12F
NH-U12P
NH-U12P SE1366
NH-U12P SE2
NH-U9
NH-U9B
NH-U9B SE2
NH-U9F

The following models can be made compatible with the AM4 socket free of charge using the NM-AM4-UxS upgrade-kit:

NH-U14S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U12S (AM4 mounting included since 2019, only older coolers require upgrade kit)
NH-U9S (AM4 mounting included since 2019, only older coolers require upgrade kit)

The following models can be made compatible with the AM4 socket free of charge using the NM-AM4-L9aL9i upgrade-kit:

NH-L9a
NH-L9i

The following models can be made compatible with the AM4 socket using the NM-AM4 upgrade-kit but are not eligible for Noctua‘s free mounting offer, so users have to purchase the kit at local resellers:

NH-U12DO (Note that the A3 version is not compatible!)
NH-U12DX
NH-U12DX 1366
NH-U12DX i4
NH-U9DX i4
NH-U9DX 1366
NH-U9DO (Note that the A3 version is not compatible!)

The following models are not compatible with the AM4 socket and can not be upgraded:

NH-U14S TR4-SP3
NH-U12S TR4-SP3
NH-U9 TR4-SP3
NH-U12DO A3
NH-U9 DO A3

Due to the heatsink mounting mechanism being identical on LGA2011 and LGA2066, Noctua’s SecuFirm2™ mounting systems for LGA2011 also support Intel’s upcoming ‘Basin Falls’ X299 HEDT (High End Desktop) platform for ‘Skylake-X’ and ‘Kaby Lake-X’ processors. Most current Noctua coolers already include SecuFirm2™ mounting systems for LGA2011 and can thus be used on LGA2066 motherboards without any upgrades or modifications.

The following models include a mounting-kit for socket LGA2011/2066 and are thus compatible out of the box:

NH-C14S
NH-D14 SE2011
NH-D15
NH-D15S
NH-D9L
NH-L12
NH-L9x65
NH-U12S
NH-U12DX i4
NH-U14S
NH-U9DX i4
NH-U9S

The following models can be made compatible with the LGA2011/LGA2066 sockets free of charge using the NM-I2011 upgrade-kit:

NH-C12P
NH-C12P SE14
NH-C14
NH-D14
NH-D15 SE-AM4
NH-U12S SE-AM4
NH-L9x65 SE-AM4
NH-U12
NH-U12F
NH-U12P
NH-U12P SE1366
NH-U12P SE2
NH-U9
NH-U9B
NH-U9B SE2
NH-U9F

The following models can be made compatible with the LGA2011/LGA2066 sockets using the NM-I2011 upgrade-kit but are not eligible for Noctua‘s free mounting offer, so users have to purchase the kit at local resellers:

NH-U12DO (Note that the A3 version is not compatible!)
NH-U12DX
NH-U12DX 1366
NH-U9DX 1366
NH-U9DO (Note that the A3 version is not compatible!)

The following models are not compatible with the LGA2011/LGA2066 sockets and can not be upgraded:

NH-L9a
NH-L9i
NH-U12DO A3
NH-U9DO A3

1. the TDP limits are extended or disabled in the motherboards' BIOS.
2. the motherboard applies automatic overclocking by default, e.g. by raising the supply voltage of the CPU and using higher Turbo-Mode multipliers.
3. some software creates untypical loads, e.g. Prime95 with AVX2 support and a) and/or b) apply.

This can lead to temperature issues, especially when using smaller coolers or compact cases.

The actual power draw of the processor can be monitored with software provided by the motherboard vendor or with 3rd party tools like HWInfo or HWMonitor.

If you encounter temperature issues (>90°C) and notice a higher than specified power draw, please ensure that no automatic overclocking is applied and limit the TDP to the specified value by choosing appropriate BIOS settings.

For Kaby Lake CPUs, it may also help to lower the CPU clock speed for applications that heavily use the AVX instruction set, which can lead to higher loads and power draw. This option is usually referred to as “AVX offset” and makes it possible to lower the multiplier specifically for AVX based applications without reducing performance when using other instruction sets. Depending on the quality of the CPU and the programs being used, a reduction of 2-3 steps usually gives very good results.

Please contact your motherboard vendor for details if you have trouble finding the appropriate settings in the BIOS.

All our TDP recommendations are based on thorough testing with the default values specified by Intel using popular applications such as Asus Realbench and prime95. Please note, however, that prime95 creates a particularly high load that goes beyond typical application scenarios and this leads to elevated temperatures. We thus recommend using other programs such as Realbench for checking the stability and temperatures of the CPU in realistic scenarios.